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mlx90290 h igh speed programmed linear hall ic 1. features and benefits ? linear hall sensor ? small size ? high sensitivity ? high accuracy ? high speed ? fast start - up for micro - power applications ? factory programmability 2. application examples ? linear position sensor ? rotary position sensor ? current sensing ? motor commutation , compatible 3. ordering information product code temperature code package code option code packing form code mlx90290 l ua aaa - xyz bu mlx90290 l se aaa - xyz re legend : temperature code: l( - 40c to 150c) package code: u a=to - 92 - 3l/ se=tsot - 3l option code: aaa - xyz: aaa = die version x = v ddnom and package options package options supply voltage se ua with straight leads ua with 2.54mm pitch, see section ?ua package, trim and form? 3.3 v 5 % x=3 x=4 5.0 v 10 % x=5 x=6 y= s rel ? 1: 5.1/t = 2.5 mv/g @ 5.0v ? 2: 6.25 1/t = 3.125 mv/g @ 5.0v ? 3: 10 1/t = 5.0 mv/g @ 5.0v ? 4: 20 1/t = 10 mv/g@ 5.0v z = tcs ? 0: 0 ppm /c ? 1: 500 ppm /c ? 2 2000 ppm /c packing form: re = reel for se cr = radial tape for ua (carton tape on reel) ca = radial tape for ua (carton tape in ammopack) bu = bulk for se or ua ordering example: mlx9 0290 - l ua - aa a - 6 12 - cr. this order code will give you a 5v ua part with leads separated by 2.54mm pitch on carton tape. the other settings a sensitivity of 25mv/mt and a thermal drift of 2000 ppm/c 3901090290 page 1 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 4. fun ctional diagram switched hall plate amplifier voltage regulator temperature compensation low pass filter demodulator analog output sensitivity trim offset trim control logic gnd out vdd vdd eeprom figure 1 functional block diagram mlx90290 5. general description the melexis mlx90290 is a second generation linear hall - effect sensor designed in mixed signal cmos technology. the device integrates a voltage regulator, hall sensor with advanced offset cancellation system and an analog output driver, all in a single package. the output voltage is proportional to the applied magne tic field and to the chip supply voltage (ratiometric). the output offset level (quiescent level) at zero magnetic field equals to 50% of the chip supply voltage. the device is offered in a rohs compliant thin small outline transistor (tsot) for surface mount and ua (to - 92) for pin through hole mount. 3901090290 page 2 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 6. table of contents 1. features and benefits ........................................................................................................................................................................... 1 2. application examples ............................................................................................................................................................................ 1 3. ordering information ............................................................................................................................................................................. 1 4. functional diagram ............................................................................................................................................................................... 2 5. gener al description .............................................................................................................................................................................. 2 6. table of contents .................................................................................................................................................................................. 3 7. glossary of terms ................................................................................................................................................................................. 4 8. absol ute maximum ratings .................................................................................................................................................................. 4 9. pin definitions and descriptions ........................................................................................................................................................... 5 10. general electrical specifications ...................................................................................................................................................... 5 11. sensor specific specifications ......................................................................................................................................................... 6 12. detailed general description ............................................................................................................................................................ 7 12.1 characteristic definitions: ............................................................................................................................................................ 7 13. unique features ............................................................................................................................................................................... 8 14. application information ..................................................................................................................................................................... 9 14.1 typical application circuit ............................................................................................................................................................ 9 14.2 application circuit for harsh and noisy environment .................................................................................................................. 9 15. standard information regarding manufacturability of melexis products with different soldering processes ................................... 10 16. esd precautions ............................................................................................................................................................................ 10 17. package information ? example from mlx90290 ........................................................................................................................... 11 17.1 ua (to92 - 3l) package information .......................................................................................................................................... 11 17.1.1 trim and form with 2.54mm distance between leads; only available on tape ................................................................... 12 18. disclaimer ....................................................................................................................................................................................... 14 19. contact information ........................................................................................................................................................................ 14 3901090290 page 3 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 7. glossary of terms tesla [t] units of magnetic flux density: 1mt = 10 gauss esd electro - static discharge tsot thin small outline transistor package psrr power supply rejection ratio ecu electronic control unit smd surface mount devices thd through hole device rohs restriction of hazardous substances 8. absolute maximum r atings parameter symbol value units supply voltage v dd - 0.3 to 7 v supply current (1) i dd 20 ma output voltage v out - 0.3 to v dd +0.3 v output current (1) i out 20 ma operating temperature range t a - 40 to 150 c maximum junction temperature t j 165 c storage temperature range t s - 55 to 165 c esd sensitivity (human body model) (2) esd hbm 4000 v esd sensitivity (charged device model) (3) (aec q100 002) esd cdm 500 v maximum flux density b > 1000 mt table 1 absolute maximum ratings ? note 1 : including the current flowing through the protection structure. maximum power dissipation should be also considered ? note 2: human body model according aec - q100 - 002 standard ? note 3: charged device model according aec - q100- 011 standard exceeding the absolute maximum ratings may cause permanent damage. exposure to absolute maximum rated conditions for extended periods may affect device reliability. 3901090290 page 4 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 9. pin definitions and descriptions se pin 1 1 vdd supply supply voltage 2 3 out i/o analog output 3 2 gnd ground ground table 2 pin definitions and descriptions 10. general electrical specifications operating characteristics, v dd = 3.15v to 5.5 v , t a = - 40 c to 150 c , c1 0.1f (unless otherwise specified) characteristics symbol test conditions min typ (1) max units supply voltage v dd operating 3.15 - 5.5 v supply current i dd 3 5 8 ma reset voltage v por out ? high impedance - 2.7 2.95 v load current range i out - 1 - 1 ma load resistance range r l connected between out and gnd 5 - infinite k : load capacitor range ( 2 ) c l connected between out and gnd 0 10 100 with r s =50 : nf output saturation voltage v oshi i out = - 1ma, b=1.1* (v dd - v oq )/s v dd - 0.25 - v dd v v oshi (2) i out = - 0.1ma, b=1.1* (v dd - v oq )/s v dd - 0.1 - v dd v v oslo i out =1ma, b=1.1*( - v oq )/s 0 - 0.25 v v oslo (2) i out =0.1ma, b=1.1*( -v oq )/s 0 - 0.1 v output resistance r out i out = 1ma - 1.5 5 : power - on time (3,4) t on v dd =v ddnom ( 5 ) , b=0.4/s rel , dv dd /dt>2v/us - 40 70 s chopping frequency f chop - 900 - khz sample / update period t sample t sample =1/f chop - 1.1 - us power supply rejection ratio ( 2 ) psrr from 80khz to 200khz 20 - - db package thermal resistance junction to ambient r thja tsot - 3l - 230 - c/w 3 - sip - ua / to92 - ua - 180 - c/w table 3 : general electrical specifications note 1 : typical values are defined at t a = 25oc and v dd = v ddno m note 2: guaranteed by design and characterization note 3: the power - on time represents the time from reaching v dd = 3.15v to vout settled within 5% from its final value note 4: power - on slew rate is not critical for the proper device start -up note 5: v ddnom = 5v or 3.3v - the value used at trimming ua package se package 3901090290 page 5 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 11. sensor specific specifications operating characteristics, v dd = 3.15v to 5.5 v , t a = - 40 c to 150 c , c1 0.1f (unless otherwise specified) parameter symbol test conditions min typ max units relative sensitivity accuracy s t a =25c, v dd =v ddnom (2) -5 - 5 % sensitivity ratiometry s - 2.5 - 2.5 % / v linearity lin v dd =v ddnom (2) - 1.5 - 1.5 % symmetry sym v dd =v ddnom (2) - 1.5 - 1.5 % relative output offset level v oqrel b=0mt, t a =25c, v dd =v ddnom (2) 0.49 0.5 0.51 - thermal offset drift t v oq (3) b=0mt, v dd =v ddnom (2) - (25mv+0.9mt*s) 0 +(25mv+0.9mt*s) - output offset ratiometry r v oqrel b=0mt - 2.5 - 2.5 % / v signal bandwidth bw at - 3db, b<0.4/s rel , ua package sot package 15 ( 4 ) 25 ( 4 ) 30 ( 4 ) 5 0 ( 4 ) - khz signal phase shift phi sine wave magnetic field at f = 1 khz ua package sot package - 3.6 ( 4 ) 2 . 4 ( 4 ) 5 ( 4 ) 3.2 ( 4 ) degree table 4 : magnetic specification parameter symbol test conditions min typ max units relative sensitivity range s rel v dd =v ddnom (2) 5 - 1 0 1 / t sensitivity temperature coefficient tcs v dd =v ddnom (2) 0 2000 ppm/c table 5 : factory programmable parameters parameter code symbol test conditions min typ max units sensitivity temperature coefficient z = 0 tcs - 40 (3) t a = - 40c, v dd =v ddnom (2) 0 ppm/c tcs 150 (5) t a =150c, v dd =v ddnom (2) 0 ppm/c sensitivity temperature coefficient z = 1 tcs - 40 (3) t a = - 40c, v dd =v ddnom (2) 0 65 0 13 00 ppm/c tcs 150 (5) t a =150c, v dd =v ddnom (2) 0 5 00 10 00 ppm/c sensitivity temperature coefficient z = 2 tcs - 40 (3) t a = - 40c, v dd =v ddnom (2) 1100 2000 2900 ppm/c tcs 150 (5) t a =150c, v dd =v ddnom (2) 1100 2000 2900 ppm/c relative sensitivity range (programmable) y = 1 s rel v dd =v ddnom (2) 5 1/t relative sensitivity range (programmable) y = 2 s rel v dd =v ddnom (2) 6.25 1/t relative sensitivity range (programmable) y = 3 s rel v dd =v ddnom (2) 10 1/t table 6 : available settings note 1 : typical values are defined at ta = 25oc and vdd = vddnom note 2: vddnom = 5v or 3.3v - the value used at trimming note 3: guaranteed by design and characterization note 4 signal bandwidth & signal phase shift mentioned here are defined for z=1 & 2, resp. 500ppm/oc & 2000ppm/oc. the option code z=0 has internal filtering disabled. products for 0ppm/oc are targeted for cur rent measurement applications. therefore, b andwidth & phase shift are not spe cified. no internal filter enables a step respo nse time in the order of us . to get an idea of the phase & amplitude behavior over frequency, use a bode diagram for a 1st order rc filter with the frequencies specified under ?band width . also note that melexis can support you to get an application spe cific filter setting. contact your sales contact in such case. note 5: guaranteed by correlation with wafer test and characterization 3901090290 page 6 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 12. detailed general description 12.1 characteristic definitions: the sensor dc output voltage is defined by: ) b . s v ( . v v rel oqrel dd out + = , [ ] v , where: dd oq oqrel v v v = , ? ? ? ? ? ? v v is the measured relative quiescent output voltage, its nominal value is 0.5; out oq v v = [ ] v is the measured quiescent output voltage at 0 b = dd out dd rel v 1 b v v s s ? ? ? = = ? ? ? ? ? ? t 1 is the relative magnetic sensitivity; dd rel out v . s b v s = ? ? = ? ? ? ? ? ? t v is the magnetic sensitivity at given supply voltage v dd . magnetic sensitivity temperature coefficient tcs is defined by: 6 a rel rel a rel 10 . ) c 25 t ( . ) c 25 ( s ) c 25 ( s ) t ( s tcs ? ? = ? ? ? ? ? ? c ppm . magnetic sensitivity ratiometry is defined by: % 100 . ) v (v . ) v ( s ) v ( s ) v ( s s ddnom dd ddnom rel ddnom rel dd rel r ? ? = ? ? ? ? ? ? v % . linearity for both positive and negative magnetic fields is defined by: % 100 . ) b ( s ) b ( s ) b ( s lin 1 rel 1 rel 2 rel ? = [ ] % , where rel 1 s 2 . 0 b = rel 2 s 4 . 0 b = dd x oq x out x rel v . b v ) b ( v ) b ( s ? = % 100 . )) b ( s ) b ( (s 2 1 ) b ( s ) b ( s sym 2 rel 1 rel 1 rel 2 rel + ? = [ ] % , where rel 1 s 4 . 0 b = rel 2 s 4 . 0 b ? =
mlx90290 h igh speed programmed linear hall ic dd x oq x out x rel v . b v ) b ( v ) b ( s ? = . output offset temperature drift is defined by: ) c 25 ( v ) t ( v v oq a oq oq t ? = [ ] mv . output offset ratiometry is calculated by: % 100 . ) v v ( . ) v ( v ) v ( v ) v ( v v ddnom dd ddnom oqrel ddnom oqrel dd oqrel oqrel r ? ? = ? ? ? ? ? ? v % . 13. unique features the mlx90290 offers a wide factory programmable temperature coefficient range to be able to operate with almost all available magnet grades or with tc = 0 ppm/degc. 3901090290 page 8 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 14. application information 14.1 typical application circuit notes: for proper operation a 100nf or bigger bypass capacitor c1 should be placed as close as possible to the vdd and gnd pins of mlx90290. for embedded applications the components r s , r l and c l are not required. vdd out gnd mlx90290 ecu rs r l c l vdd output gnd +5v (3.3v) c 1 0.1uf module 14.2 application circuit for harsh and noisy environment vdd out gnd mlx90290 ecu rs r l c l c 3 vdd output gnd +5v (3.3v) c 1 0.1uf c 2 notes: for proper operation a 100nf or bigger bypass capacitor c1 should be placed as close as possible to the vdd and gnd pins of mlx90290. for harsh and noisy environment, a bypass capacitor c2 of 1nf to 10nf can be placed on the output. for improved emc performance an additional resistance, rs and capacitors, c3 and c4 placed close to the connector of the module are recommended. recommended values for: rs 50e, 1nf c3 4.7nf, 1nf c4 10nf. for embedded applications the components r l and c l are not required. c 4 module 3901090290 page 9 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 15. standard information regarding manufacturability of melexis products with different soldering processes our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: reflow soldering smd?s ( s urface m ount d evices) ? ipc/jedec j - std - 020 moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices (classification reflow profiles according to table 5 - 2) ? eia/jedec jesd22 - a113 preconditioning of nonhermetic surface mount devices prior to reliability testing (r eflow profiles according to table 2) wave soldering smd?s ( s urface m ount d evices) and thd?s ( t hrough h ole d evices) ? en60749 - 20 resistance of plastic - encapsulated smd?s to combined effect of moisture and soldering heat ? eia/jedec jesd22 - b106 and en60749 - 15 resistance to soldering temperature for through - hole mounted devices iron soldering thd?s ( t hrough h ole d evices) ? en60749 - 15 resistance to soldering temperature for through - hole mounted devices solderability smd?s ( s urface m ount d evices) and thd?s ( t hrough h ole d evices) ? eia/jedec jesd22 - b102 and en60749 - 21 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with melexis. the application of wave soldering for smd?s is allowed only after consulting melexis regarding assurance of adhesive strength between device and board. melexis recommends reviewing on our web site the general guidelines soldering recommendation ( http://www.melexis.com/quality_soldering.aspx ) as well as trim&form recommendations (http://www.melex is.com/assets/trim - and - form - recommendations - 5565.aspx). melexis is contributing to global environmental conservation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on the rest riction of the use of certain hazardous substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 16. esd precautions electronic semiconductor products are sensitive to electro static discharge (esd). always observe electro static discharge control procedures whenever handling semiconductor products. 3901090290 page 10 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 17. package information ? example from mlx9 0290 17.1 ua (to92 - 3l) package information 4 . 10 +/ - 0 . 20 3 . 00 +/ - 0 . 20 1 . 00 +/ - 0 . 10 0 . 46 + 0 . 02 - 0 . 03 0 . 38 +/ - 0 . 03 1 . 27 +/ - 0 . 03 2 . 54 +/ - 0 . 03 0 . 15 max 14 . 5 0 +/ - 0 . 5 0 1 . 50 +/ - 0 . 10 7 nom 7 nom 0 . 38 +/ - 0 . 03 7 nom 45 nom notes : 1 . all dimensions are in millimeters 2 . package dimension do not include mold protrusion . 3 . the end flash shall not exceed 0 . 127 mm on each side . 4 . to preserve reliability , it is recommended to have total lead length equal to 2 . 5 mm minimum , measured from the package line . top marking : 1 st line : 290 2 nd line : date code y = last digit of calendar year ww = calender week # 2 . 5 min see note 4 hall plate location remarks : 1 . all dimensions are in millimeters 2 . 62 + 0 . 10 - 0 . 11 0 . 74 + 0 . 10 - 0 . 11 0 . 41 0 . 45 1 . 92 2 . 1 8 1 . 31 1 . 57 marked side 0 . 15 max 1 . 20 ref 290 yww pin 1 3901090290 page 11 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 17.1.1 trim and form with 2.54mm distance between leads; only available on tape parameter component height component position hole diameter hole position hole pitc h component pitch right - left bending h1 p2 do w1 po p1 p nominal (& tolerance) 19mm (0.5) 6.35mm (0.4) 4mm (0.2) 9mm (- 0.5;+0.75) 12.7mm (0.3) 12.7mm (0.3) 0.4mm parameter lead spacing front - rear bending tape width adhesive tape width adhesive to carrier tape gap vertical lead length component height top f1 & f2 h w wo w2 ho h2 nominal (& tolerance) 2.54mm (0.25mm) .0.3deg 18mm (0.5) 6mm (0.2) 0.5mm (- 0.5; +0.3) 15.5mm (0.5) 22.0mm (0.8mm) 3901090290 page 12 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 2 . 75 bsc 1 . 60 bsc 1 . 90 bsc 2 . 90 bsc 0 . 30 0 . 45 0 . 88 + 0 . 02 - 0 . 03 1 . 0 0 max 0 . 95 bsc 0 . 075 + 0 . 025 - 0 . 050 seating plane 0 . 575 ref . 0 . 40 +/ - 0 . 10 0 . 50 bsc 0 . 127 + 0 . 023 - 0 . 007 0 . 15 0 . 20 with plating ~ base metal section b - b? b b? notes : 1 . all dimensions are in millimeters 2 . outermost plastic extreme width does not include mold flash or protrusions . mold flash and protrusions shall not exceed 0 . 15 mm per side . 3 . outermost plastic extreme length does not include mold flash or protrusions . mold flash and protrusions shall not exceed 0 . 25 mm per side . 4 . the lead width dimension does not include dambar protrusion . allowable dambar protrusion shall be 0 . 07 mm total in excess of the lead width dimension at maximum material condition . 5 . dimension is the length of terminal for soldering to a substrate . 6 . dimension on section b - b? applies to the flat section of the lead between 0 . 08 mm and 0 . 15 mm from the lead tip . 7 . formed lead shall be planar with respect to one another with 0 . 076 mm at seating plane . marking : top marking : bottom marking : see note 2 see note 3 see note 5 12 ref . typ . 0 . 35 + 0 . 05 - 0 . 10 0 . 30 0 . 45 0 . 10 r . min . 0 . 20 4 +/ - 4 0 . 10 r . min . see note 6 seating plane top view end view side view hall plate location remarks : 1 . all dimensions are in millimeters top view end view package line 0 . 275 typ 1 . 4 5 +/ - 0 . 12 0 . 80 +/ - 0 . 12 pin 1 xxx - last three digits of the lot date code - ww - calender week date code - yy - calender year pin 1 3901090290 page 13 of 14 data s heet rev 001 october 2014
mlx90290 h igh speed programmed linear hall ic 18. disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with melexis for current information. this product is intended for use in normal commercial applica tions. applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life - support or life - sustaining equipment are specifically not recommended without additional processi ng by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property d amage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liabili ty to recipient or any third party shall arise or flow out of melexis? rendering of technical or other services. ? 20 14 melexis nv. all rights reserved. 19. contact information for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direct: europe, africa, asia: america: phone: +32 1367 0495 phone: +1 248 306 5400 e - mail: sales_europe@melexis.com e - mail: sales_usa@melexis.com iso/ts 16949 and iso14001 certified 3901090290 page 14 of 14 data s heet rev 001 october 2014

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